Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


change from reflow to glue

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#66792

change from reflow to glue | 10 July, 2012

Hi, when we change model from reflow temperature profile to temperature profile for glue, we always open oven to cool down. It is good for oven? Thank you for your answer.

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#66793

change from reflow to glue | 10 July, 2012

Hello, the best way is to set the oven to cooldown. Opening the oven is not very good idea, but is not a big issue I think, only bad air in the production. Try if you can to make production from glue to Pb free if it is possible.

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#66796

change from reflow to glue | 10 July, 2012

We do the same when it happens, we only warn the people arround to stay away while the oven is open, or delimitate the oven with a caution cord.

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#66815

change from reflow to glue | 12 July, 2012

Check with your adhesive manufacturer. In a previous life we had one line that was either double sided reflow or wave following reflow. When it was ds reflow, we just shut off the wave. When it was reflow/wave, we kept the reflow oven on with the standard reflow profile. Our adhesive mfg said that the reflow profile would not adversely affect the adhesive cure. In fact it would slightly improve adhesion because of the higher cure temp. If they say no, then put up big warning signs that say "HOT, DO NOT TOUCH".

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reflow oven profiler

Reflow Oven