Low yields on RFM TR3000 transceiver ICs| 4 June, 2001
Have been having problems with the above IC but dont know why. Our profile is well within the manufacuters recommendations. We are getting a higher than desired first off fail rate and are concerned. It is not possible to inspect the soldering as there are no visable terminations. The package has bottom only terminations so dont know if there is a soldering issue. All other components on the PCB solder well. Its placement seems to be alligned ok but once again its hard to tell.
Has/is anyone else out there using this device or has used it? Has anyone had the same problems as us?