Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Use of Stored PCB

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#66018

Use of Stored PCB | 19 March, 2012

If PCB supplier has stored PCB in complete IPC specified storage condition and let say they kept for 2 Years. Are these PCB still good for use? I understand about shelf life and baking procedure but I am not sure how long PCB are good for use if they kept with complete storage condition.

Thank you for your help in advance.

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#66019

Use of Stored PCB | 19 March, 2012

J-STD-003B prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes.

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kim

#66054

Use of Stored PCB | 23 March, 2012

> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.

> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.

> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.

> J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. This standard is intended for use by > both vendor and user. The objective of the > solderability test methods described in this > standard is to determine the ability of printed > board surface conductors, attachment lands, and > plated-through holes to wet easily with solder > and to withstand the rigors of the printed board > assembly processes.

Hello, generally speaking, within 6 months is available

Skype: keilah2015 +86-15889765620

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