Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Process ideas for adhesive on bottom side SMD's and wave solder

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#65513

Process ideas for adhesive on bottom side SMD's and wave solder | 22 November, 2011

I am looking for process suggestions. We want to use a pin transfer system to deposit adhesive to hold bottom side SMD's in place. We will place SMD's and through hole power parts on the top side and then run through a wave solder machine. Are there any processing tips and things to avoid?

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#65515

Process ideas for adhesive on bottom side SMD's and wave solder | 23 November, 2011

Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.

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#65516

Process ideas for adhesive on bottom side SMD's and wave solder | 23 November, 2011

We agree with the points made by ScottE above. Additionally, most printers are not heavily loaded. So, you wouldn't have to buy another machine, give-up floor space, purchase and store peculiar tooling, etc.

We think Darby does pin transfer. Maybe he'll post, if he comes off the beach.

Hail even if our printer was broken or loaded, we'd prefer to use a dispenser rather than pin transfer to apply adhesive. At least you can use a dispenser for other type of work.

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#65517

Process ideas for adhesive on bottom side SMD's and wave solder | 23 November, 2011

More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific application methods, and do not necessarily work with another method. We had an adhesive for screen print, a different for pin transfer, and yet a different one for syringe dispense.

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