Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Process Tin lead vs lead free components

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#65003

Process Tin lead vs lead free components | 12 September, 2011

Hi All We have run SMT process with SnPb but we’re installing some lead free components like capacitors and resistor lead free. After the reflow oven all components have good appearance with solder join sheen. But the lead free components the solder join have appearance like cold-solder. You know if exist some criteria for this type of process. My boards are Type II. I need to know if this solder join is acceptable and know if exist a standard?

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#65011

Process Tin lead vs lead free components | 13 September, 2011

Lead free solder does tend to resemble cold solder joints after processing. Generally, this is acceptable.

The latest IPC 610 has pictures of acceptability of lead free solder joints, which you can use to compare to the joints that you are seeing on the boards.

Cheers, ..rob

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#65021

Process Tin lead vs lead free components | 14 September, 2011

Target those specific parts/leads with a thermal-couple and a mole and try to get the peak reflow temps up to 225 C. It's not a cure but it will improve the apperance of the solder joints.

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