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Dye and Pry on PoPs?

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#64828

Dye and Pry on PoPs? | 15 August, 2011

Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect.

What other technique can anyone recommend?

BWET

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#64829

Dye and Pry on PoPs? | 16 August, 2011

C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.

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#64830

Dye and Pry on PoPs? | 16 August, 2011

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also do cross-sections to look at each solder joint.

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#64863

Dye and Pry on PoPs? | 19 August, 2011

In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating process. After documenting the defect we will take corrective action to resolve the issue and provide you with working product to confirm our prognosis. Contact me if you will like to discuss in detail

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#64864

Dye and Pry on PoPs? | 19 August, 2011

Its not a problem to do you just modify the procedure slightly for the smaller thinner parts. There some images and on my CD ROM and posters see http://www.packageonpackage.co.uk website

I will also be doing a workshop at APEX and there is a webinar on the subject coming up soon.

Bob Willis

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