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Dealing with BGA solder ball in via hole

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#64011

Dealing with BGA solder ball in via hole | 23 March, 2011

I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not electrically connected due to a open via that is situated in the pad.

Is there anything that can be done to salvage these few prototype circuit boards? What equipment and temperatures can be used?

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#64019

Dealing with BGA solder ball in via hole | 24 March, 2011

Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.

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#64020

Dealing with BGA solder ball in via hole | 24 March, 2011

Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB.

Could I do anything to connect the pad or fill the via? Much of the board has been populated and soldered by hand.

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#64021

Dealing with BGA solder ball in via hole | 24 March, 2011

Can you jumper the via to the pad?

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#64023

Dealing with BGA solder ball in via hole | 24 March, 2011

That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?

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