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IPC/JEDEC standard for solder paste printing defects

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#64000

IPC/JEDEC standard for solder paste printing defects | 23 March, 2011

Hi All.

I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document should I refer if I want to know the details of the defects?

Thank you.

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#64005

IPC/JEDEC standard for solder paste printing defects | 23 March, 2011

There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making good solder connections is something that you need to determine. Just make good solder connections.

If the brochures of SPI Machines are incorrect, reprogram the machine to produce the output that meets your requirements.

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#64027

IPC/JEDEC standard for solder paste printing defects | 25 March, 2011

Thank you for the reply, Davef.

I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percentage of its volume)

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#64031

IPC/JEDEC standard for solder paste printing defects | 25 March, 2011

IPC-7525 Stencil Design Guidelines

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