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Patented Leadless, Fluxless Solder Alloy join different material

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Patented Leadless, Fluxless Solder Alloy join different material | 20 January, 2011

Dear Industry experts,

We have just developed a leadless, fluxless solder that can join various metals ) Al, Cu, brass, Steel, stainless and Titanium) and Ceramics ( Ruby, Quartz, Sapphires, glass, TiO2, etc)

We intend to explore electronics and RF applications for Al ( external radar antenna, replacing the need for gold plating.

Do you think there can be any market potential, supposing it pass all reliability tests?

Your opinions appreciated.

Yang

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