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Heat transfer properties of encapsulate potting material.

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Heat transfer properties of encapsulate potting material. | 28 December, 2010

I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density.

Has anyone have good table detailing different potting material along with specific heat capacity and density and thermal conductivity. So I can calculate the thermal capacitance as part of spice simulation.

Thanks.

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