Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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QFN (9x9) Thermal Capacitance Model

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QFN (9x9) Thermal Capacitance Model | 28 December, 2010

Hi

Has anyone has thermal capacitance model for QFN (9x9) package with exposed pad 7 x 7 (or 6 x 6). Ideally between junction and case, junction case and board (JESD51-7 or similar).

I wish to do transient with spice, to established how long it take to heat the device up for 10 - 200 seconds.

Thanks

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