Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
Has anyone has thermal capacitance model for QFN (9x9)...
- Dec 28, 2010
QFN (9x9) Thermal Capacitance Model | 28 December, 2010
Has anyone has thermal capacitance model for QFN (9x9) package with exposed pad 7 x 7 (or 6 x 6). Ideally between junction and case, junction case and board (JESD51-7 or similar).
I wish to do transient with spice, to established how long it take to heat the device up for 10 - 200 seconds.
© 1995-2016 SMTnet
Who are SMTnet visitors?
Become a member now and receive the value and benefits of membership.