Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

COB and wire bond



COB and wire bond | 7 May, 2001

Hi all.

I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process, the equipment and the kind of price tag on those equipments. The max. dimension of the substrate / PCB is 10"x6".

Thanks Singh

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COB and wire bond | 7 May, 2001


The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area. There are other bonders out there who can do smaller and large bond area than we can but, I would like to discuss this with you off-line if that is O.K. with you. I would be happy to give you my two cents on wire bonding. It is certainly different from SMT in that it is usually a very customized process. Just call me I won't bite. (847)288-4569


J.D. of Panasonic Create (847) 288-4569

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COB and wire bond | 7 May, 2001

Here's a ball park [WAG] guess on equipment costs assuming screened and diced die:

Die attach ~$220k

Cure oven ~$20k

Wire bonder ~$110k [8 bonds => 4 wire per sec ... you figure how many you need]

Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k

Throw in a another ~$100k for marking and cleaning

Check the September 2000 SMTnet Newsletter [] for a review of Harmon "Wire Bonding In Microelectronics"

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COB and wire bond | 3 June, 2002

We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc.,

Thanks V.RAMANAND KINI...03.06.02

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COB and wire bond | 4 June, 2002

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you the equipment you'll find out soon that when you are on your own all case studies results do not apply.Both die attach and wire bonding need to be tightly monitored.Latent failures due to wire bonding come to be very expensive.There is quite a bit of literture out there about ball bonding.Wedge bonding is a different story. material selection is critical as well for die-attach,uv parameters,etc.Add a plasma cleaner to Dave's list,preferably one with both Argon and Oxigen best of luck. Rob

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