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ROHS 6/6 BGA device in Non-ROHS reflow

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#62921

ROHS 6/6 BGA device in Non-ROHS reflow | 14 October, 2010

Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment.

I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is available now.

One way out I am thinking is, not sure if it is correct or not. -

Can we use leaded solder paste/solder cream for soldering this Non-leaded[ROHS6/6]device on board? Because of lower temp. [240 Deg.C] this Non-leaded[ROHS6/6] device balls may not melt but leaded solder paste [suppose to melt at 240C] will help.

Thanks, Sachin Nalbalwar

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#62941

ROHS 6/6 BGA device in Non-ROHS reflow | 18 October, 2010

Use the forums nice search feature above. "Lead Free BGA" Lots of info.

In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your TAL a little longer. Excepting Aerospace and other high reliability applications. Commercial stuff likely OK.

Most SAC Alloys melt around 217 -221C so your normal tin lead process should be fine, as long as your peak solder temperature is at least 200-225C, and time above reflow about 60-75 seconds.

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#62951

ROHS 6/6 BGA device in Non-ROHS reflow | 20 October, 2010

Thanks for suggestion Hegemon.

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