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Solderability - Gold Pad Cleaning

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#62608

Solderability - Gold Pad Cleaning | 1 September, 2010

Having solder flow issues on gold pads. Issues started when supplier switched adhesive tape used to cover pads during varnish process. By running SEM/EDX and XPS analysis it has been determined that the new tape leaves behind a thicker organic residue (C and O) than the old tape. Have tried cleaning the pads with IPA and Dow Corning OS-10 solvents to produce good solderability results and both have failed. Looking for an intermediary solution to clean the gold pads to remove residue to produce good solder joints while we solve the adhesive issue. Any recommendations for solvents to use would help.

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#62613

Solderability - Gold Pad Cleaning | 2 September, 2010

Hi Kevm, would it help to try solderability test of these pads using an agressive flux during soldering? Just a thought.

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#62622

Solderability - Gold Pad Cleaning | 2 September, 2010

GooGone followed by a water wash

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#62626

Solderability - Gold Pad Cleaning | 2 September, 2010

We have tried solderability testing using an agressive flux and have had good results. However, our Mfg process uses laser soldering equipment which is a validated process and we are limited on the type and amount of flux we can use due to ionic contamination. Thanks though.

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