Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


QFN Rework

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#62341

QFN Rework | 30 July, 2010

We are trying to benchmark processes being used for QFN rework and have broken them down in to:

1. Devices with outline package sizes 2. Devices with outline package sizes >= 3 x 3mm http://www.solder.net/stencilmate.asp

Inputs would be appreciated!

BWET

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