Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Losing balls on BGA's after second side reflow

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JM

#62092

Losing balls on BGA's after second side reflow | 21 June, 2010

Hello, need some help if anyone has any insight on this issue. Ran first side and ex-ray indicates BGA parts look normal. Ran the second side and now the BGA balls on first side appear to have broken free and moved under part. This board has BGA's on both sides. Anyone heard or seen this issue? Any help would be greatly appreciated. Thanks Jack

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CL

#62116

Losing balls on BGA's after second side reflow | 25 June, 2010

Good Morning JM,

Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part?

Thanks

Chris

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SC

#62120

Losing balls on BGA's after second side reflow | 25 June, 2010

Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.

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