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Vapor/ensolve flux cleaning

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TJG

#61712

Vapor/ensolve flux cleaning | 28 April, 2010

Our latest designs are flip chip on flex based and we have issues with delamination/blistering. We know it is related to our vapor solvent (n-Propyl Bromide based) attacking an inner layer adhesive. Has anyone else ever heard of something like this? Is there alternatives I can look at other then switching to a water based cleaning system or not cleaning? Thanks in advance!

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#61713

Vapor/ensolve flux cleaning | 28 April, 2010

When we hear the words 'flexible circuit' and 'delamination' in the same sentence, we think: * Excessive reflow temperature. * Entrapped moisture.

Boardhouse: I hope this is a step towards redemption.

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