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Ultrasonic detector instead of X-ray

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#61608

Ultrasonic detector instead of X-ray | 14 April, 2010

Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer for SMT-Applications? Or doesn't it work?

Thank you for your reply!

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#61609

Ultrasonic detector instead of X-ray | 14 April, 2010

It won't work. An acoustic signal can't punch through a BGA. The signals reflect at every interface. So, it works for flip chip, but there are too many interfaces in CSP and BGA.

Equipment, Inspection, Acoustic microscope * MicroPhotonics * Sonoscan Corp * Sonix

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#61625

Ultrasonic detector instead of X-ray | 16 April, 2010

Thank you for the links. I didn't know that there are companys that build test systems for ultrasonic inspection. My idea was to use a ultrasonic detector similar to crack inspection, for example to detect if the cooling pad is melted, or a solder joint connected well with the PCB. I think you should see also voids, cracks or pollutions in a solder joint. If you take a simple ultrasonic detector, isn't it possible to check, if a solder joint is in tollerance? I agree that it dont' work for BGA's.

Is there anybody using such a method?

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