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SMT electronics assembly manufacturing forum.


Mydata My100 or Siemens D1?

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TQS

#60904

Mydata My100 or Siemens D1? | 24 January, 2010

Hi I would like to get feedback on which of the following 2 machines to buy: -option 1: My100 with single Midas head -option 2: D1S with single P&P head

I have experience with the Siemens D series. However I have no real experience with Mydata... Is this new machine reliable? We have to place FC die and I am concerned with the Mydata ability to place FC... Would the moving Y wagon cause the tiny die to move post placement? The reason I am considering Mydata is because this SMT line is meant for NPI and very low-vol production.

Thanks Walid

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#60905

Mydata My100 or Siemens D1? | 25 January, 2010

Hello, Mydata p&p machines are built for high mixed and low/mid volume production, so if you talk about very low volume - no doubt, mydata is what you can use. You can consider 2 models for your application - MY100SX or MY100LX, depending on the min size of your components. Of course, Mydata can place FCs. You can read it in the official Mydata specs. The only question is, are you going to place bare dies? If so, you need to think of how will you feed your FCs in the machine. And what are your requirements for the placement accuracy? May be, it is better to use a die bonder with FC bonding capability. However, the price of such machines is pretty high. Regarding the components displacement due to the Y-wagon moving, the answer is no. If you read the Mydata specs, you will see that their machines are able to place components from 01005 and ICs with leads pitch of 0.1 mm. Would it be possible, if the Y-wagon movement caused components displacement?

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TQS

#60906

Mydata My100 or Siemens D1? | 25 January, 2010

Thanks for feedback.

We already have 2 Datacon machines as we are mostly building microelectronics modules.

The FC dies are pretty small and light. Bumps are <70um on size. I am concerned that he moving y wagon would cause those dies to move post placement...

What about the Siemens D1? Anyone with experience? Thanks.

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#60907

Mydata My100 or Siemens D1? | 25 January, 2010

If the bumps are so small, I do not see any reason for considering Mydata, Siemens or any SMT p&p machine. Datacon's die bonders are very good ones. In your case, I would keep using them.

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#60948

Mydata My100 or Siemens D1? | 27 January, 2010

Hello TQS, We have made Micro Mechanics adapters for Mydata. The Micro Mechanics tips are used in die bonding machines. I have no doubt that an adapted nozzle would hold your die securely. From Grants posts in the past, he had problems with placement accuracy on the older Mydata machines, perhaps the new Mydata machines that Sergey mentioned will fill your need. For the ultimate in placement accuracy take a look at Air Vacs highly modified Juki machines.

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TQS

#60955

Mydata My100 or Siemens D1? | 27 January, 2010

Thanks for the recommendations.

We have settled on the new Juki CX-1. Juki states that the machine is a hybrid between a MCM placer and an SMT placer. This machine, if it is capable to do what Juki says it can do, is exactly the machine we need.

Machine ships in 8 weeks. I will let you know how things go then... Thanks.

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#60964

Mydata My100 or Siemens D1? | 28 January, 2010

Walid,

I just learned today that our ONYX500 Production Cell demo unit machine is for sale. This is located in our Connecticut office. You can use Juki feeders and tips (we buy them from Fred) and have a >9 micron placement accuracy. Includes Flipper unit, dispenser and double nozzle changer. Any interest?

Howard (AIRVAC)

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#61124

Mydata My100 or Siemens D1? | 15 February, 2010

The CX-1 is a good choice. As accuarte as a die bonder, and as fast as an SMT placer. We love ours.

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