Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Indium / Tin Paste Properties

#6272

Indium / Tin Paste Properties | 24 August, 2000

Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.

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Dr. Ning-Cheng Lee

#6273

Re: Indium / Tin Paste Properties | 24 August, 2000

52In/48Sn solder has a melting point 118C, and can be reflow processed at temperature down to around 165-170C. The material is very soft, very low in shear strength. It is relatively ductile, can be stretched to about 2-3X of Sn63 in elongation. Among all of Pb-free alloy options, this one is the lowest in mp. It is mainly used in some nitche applications.

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