Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


SN96 solderability on electrolytic tin

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#60489

SN96 solderability on electrolytic tin | 19 November, 2009

We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside test lab to perform solderability testing per IPC J-STD-003B (edge dip test)on multiple samples of the same product using both 63/37 and SN96. All samples using 63/37 passed while all samples using SN96 failed due to dewetting. As a side note the tin was plated on these parts in august of this year. Could someone please shed some light on this problem as my customer is looking for answers.

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#60552

SN96 solderability on electrolytic tin | 24 November, 2009

It could be that the Sn96 has dissolved the Tin rapidly and gone for the Copper. What dwell times are they using with the irons? Probably better off using a Tin Copper alloy for reduced dissolution worth a try Cheers Greg

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#60684

SN96 solderability on electrolytic tin | 17 December, 2009

was the wetting test conducted with SN96? Do any Pull or stress testing?

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