For any rework machine a good optics system is important. A look-up look down is used for BGA components. 30X magnification is required for flip chip, MicroBGA and fine pitch QFP placement. Digital cameras are not required, CCD have a good enough resolution to place components. For QFP and other leaded devices, it is always better to look down at the site and adjust the component when it is as close to the board as possible.