Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


printing speed - paste vs. glue

Views: 1548

#60066

printing speed - paste vs. glue | 8 October, 2009

We have 250x340mm panel of PCBs. Stencil for glue would be 0,3mm with about 80 holes mostly for chip components. Our MPM printer at standard set, prints paste on 1 panel at 40-50sec.

I need general information if printing glue is faster or slower process in compare to printing paste.

reply »

#60067

printing speed - paste vs. glue | 8 October, 2009

#60075

printing speed - paste vs. glue | 9 October, 2009

Thanks. Unfortunatelly I did not find answer on my question. Dispensing glue generally has much worse output then printing glue.

Question remains - how output of printing paste is compared to output of printing glue ?

reply »

#60078

printing speed - paste vs. glue | 9 October, 2009

Here's what is on that post referred to, not sure what you need more than ...

"* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, aperture size was an oblong shape , 0.030" long x 0.015" wide. A minimum of 0.010" gap between the aperture and pad, both sides. * Snapoff: to increase dot height, upto 0.040" can be used * Squeegee material: metal on metal, polycarbonate on plastic * Print speed: 1 to 2" per sec * Squeegee pressure: 0.2 to 0.3 kg/cm ... enough to clean wipe the stencil * Separation speed: Slow ... 0.1 to 0.5 mm/sec over 3mm separation distance * Print sequence: print print"

... further, we guess that you're printing at 1-2 inches per second.

reply »

Reflow Ovens thermal process improvement

SMT in-printer dispensing