Good Morning! I need some clarification. Our company is working with a start up company on some prototypes. On the bottom of the assembly they are placing a SOT23-5 component. It is being presented to the wave so the lead banks are parallel to the wave. After some research and discussion, I am confused as to which is the best method - presenting dip style components to the wave perpindicular (for drag off) or parallel. Currently, the three pins on the leading edge of the part are bridging on every board. Will this component solder better if given an extra drag off pads and rotated 90 deg?