Hi Sir Charles! Good Day! I hope you can help me about my queries.
1. What is the acceptable misregistration or misalignment of balls after reflow soldering of PBGA module on the PCB? 2. Is there any criteria for solder ball defect or solder beads under PBGA package? if there is, what is the minimum size? and how many are allowable? 3. How about voids? is there a minimum size or percentage inside the balls of PBGA? 4. Is there a minimum solder joint acceptance for the balls of PBGA, how many percent?
I'm looking forward for your help regarding my queries, it would be highly appreciated. Thanks in advance and more power!!