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Solder Ball and Splash after Hand Soldering

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#59359

Solder Ball and Splash after Hand Soldering | 22 July, 2009

Hi SMTnet Team,

I had facing a lot of feedback from my customer interm of the solder splash and solder ball, After I check my process the issues came from manual soldering process.

Is any one having the same problem with me ?, any one have solution to that. I had running for high mix low volume product with more than 1K models family.

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#59376

Solder Ball and Splash after Hand Soldering | 24 July, 2009

Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperature of the soldering iron * Preheat of the soldered assembly * Solids content of the flux selection * Solder mask compatibility with flux

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#59383

Solder Ball and Splash after Hand Soldering | 24 July, 2009

Hi Dave,

Thanks on your feedback,

May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?

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#59385

Solder Ball and Splash after Hand Soldering | 25 July, 2009

Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper thickness helps eliminate the out-gassing.

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#59391

Solder Ball and Splash after Hand Soldering | 26 July, 2009

Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate?

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