We are in the process of transitioning from OA flux to No-Clean. Because of the tighter process window there is a lot of concern about component and PCB solderability and storage. The last thing we want to do is put some solderability specification that is non-standard or unattainable by suppliers on our drawings ($$$).
What is the industry norm for folks that have been using NC flux? Is adding J-std-002 and -003 a good idea on PCB and component drawings? This is an old debate within our company and need some insight.