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Solderability using No-Clean Flux

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Solderability using No-Clean Flux | 7 July, 2009

We are in the process of transitioning from OA flux to No-Clean. Because of the tighter process window there is a lot of concern about component and PCB solderability and storage. The last thing we want to do is put some solderability specification that is non-standard or unattainable by suppliers on our drawings ($$$).

What is the industry norm for folks that have been using NC flux? Is adding J-std-002 and -003 a good idea on PCB and component drawings? This is an old debate within our company and need some insight.

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Solderability using No-Clean Flux | 8 July, 2009

We know nothing about your product, it's end-use environment, possible compatibility with other materials, and on-and-on.

These may help *


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