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sri repairs pad repairs

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#58840

sri repairs pad repairs | 19 May, 2009

Has anyone used a hot press to bond new pads to the boards if they have been lifted?

we have one and have tried and carried out some DOE's on FR4 boards but when trying the same settings on Polyamide they basically fell of can anyone give any pointers?

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#58853

sri repairs pad repairs | 19 May, 2009

We use epoxy to repair damaged pads

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#58920

sri repairs pad repairs | 28 May, 2009

We use an epoxy method at the moment but the cure times are long with 4 hours oven cure and 4 hours air cure before solder can be applied to the pad

the hot press bonds the already made epoxy pad to the board in less than 5 min and is ready to solder straight away

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