Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Wire bond failure

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#57789

Wire bond failure | 15 January, 2009

We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination.

We're running a lead free process with aqueous wash. 700 components on board but only one is problematic. Any thoughts where this could be introduced? We've omega metered boards in various stages and all seems OK.

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#57794

Wire bond failure | 15 January, 2009

Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis

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