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Solid Solder Deposit



Solid Solder Deposit | 23 April, 2001

We are currently investigating getting a small SMT line in-house...very low quantities. I have been looking at Screen Printers and have also stumbled across Solid Solder Deposit Technology at 2 companies. I'm not sure whether we want to have the Solder Paste and Maintenance issues with a Screen Printer, or try theSolid Solder Technology appears to have been out since 1991. (Those are the only two I was able to locate). Can anyone else point me in the right direction or give any pros/cons in either direction.

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Solid Solder Deposit | 23 April, 2001

You may have answered your own question. If SSD is the end all save all there would be more people using this technology. I view SSD as an option to have flat planar pads. I also know the price per Board is more then "standard" boards. The sample boards we ran the self aligning property of the components were not good - where you put the component is where the component stays thus meaning a placement machine with a higher degree of accuracy. Can SSD handle ultra fine pitch devices <20mil? From the samples I have the SSD is over the pad sides and in some cases touches the solder mask. The boards come with a presure sensitive paper/or wax paper cover -will you be removing this manually or automatically? Also, what process control measures do you have in place for evaluating SSD boards?

You may also want to go the "All in One route" there are machines out there that dispence, place, and reflow all in one machine i.e. Beamworks


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Solid Solder Deposit | 23 April, 2001

Cal is correct. Sipad, Precision Pad, Optipad, SSD, and all that were a feeble Euroland approach to creating flat pads for fine pitch assembly. To begin with, they required a complete board redesign using their proprietary software. [Oooo, me first, me first!!!] I submitted a moderately cogent discussion of this in a previous thread acuppla years ago, but it was whipped in the latest SMTnet conversion and I'm too tired to recreate it. Check the Merix site for comparison of major approaches to solderability protection.

Listen, you shouldn't get too worked-up about getting solder paste on the board. One of those hand operated "paste caulking guns" that cost about 50 bucks will work just fine for the majority of components placed, especially in a prototype, low volume, rework environment. [There that autta light 'em up!!!]

So, tell me why do you need to spend money on equipment? Shouldn't you be using a contractor to maximize the benefit to your owners? [If the first one didn't get em going, this'll!!!]

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Solid Solder Deposit | 24 April, 2001

A small SMT line? I have conections for a New screen printer (MPM), Essemtec Placement machine, and Reflow oven (Electrovert) for $100K Let me know how interested you are.

Caldon W. Driscoll ACI USA 610-362-1200

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Matt Kehoe


Solid Solder Deposit | 17 October, 2001

Hey Dave,

I beg to differ. ssd is currently available in the US, very reliable, and cost effective on many designs.

Minor modifications to the films are sometimes required but only when the design itself is sub standard.

ssd has come a long way since its first attempt in the US in 1995.

If you would like, I could expand on this for you. Just lemmeknow.


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Solid Solder Deposit | 17 October, 2001

Thank you.

I never said that Sipad, Precision Pad, Optipad, and SSD were not available in the US. Are you saying that these products were not developed in Euroland?

Please provide links to papers describing the reliability, cost, list of multiple supplier contacts, characteristics of designs where SSD works, impact of WEEE legislation, and other factors of Sipad, Precision Pad, Optipad, and SSD as compared to other forms of solderability protection.

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Solid Solder Deposit | 19 October, 2001


my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run.

What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto the PCB nickle (BIB) pads.

Pitfalls are :

1) the PCB cannot be subject to certain baking temperatures, (no one remembers the recommend limits) Ours was a BIB (backplane board), so it required mandortary baking process.

2) the PCB pads advisable NOT to chemical clean de surfaces. (wetting looks awful after chemical cleans).

3) Ensure conveyor/manual handling isn't vigorous, to avoid "shifting" of the "paste".

4) per board costing under this method against "convential" screening printing processes, has a $delta of 70% difference.

+ve Points :

1) the wetting was bleeding Great! quality records show inprocess SMT wetting rejects were "non-existence".

Summary : you pay for the great solder wetting, cost-justify it and mebbe share your own decisions wif us?

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Matt Kehoe


Solid Solder Deposit | 16 November, 2001

Hi Dave.

Sorry I have not responded. Just as I was getting into this forum activity the company I worked for (past tense) decided not to re join the SMTA and I was cut off.

Anyways, you can find most of what you asked for about SIPAD on the Midwest Printed Circuits, (my x employer) web site at Look in capabilities under solid solder deposition.

There are some of my papers from past Nepcon and SMTA shows, one from the IPC conference on alternaticve surface finishes, as well as some NASA evaluations etc. The NASA information on the site consists of "excerpts" from the full report. To view the full report, go to my secret link, (I was the web master)

This will include pictures etc.

SIPAD has only been available from Midwest Printed Circuits for the last 3 years. Beginning December 1st, SIPAD will be available from my new company, SIPAD Systems Inc. as a coating service similar to out sourced gold, soldermask, tin, etc. I set up and managed the Midwest Printed Circuits facility for the last 3 years. I am ready to move forward and would love a chance to discuss SIPAD with you further.

If you have any questions please let me know.

Matt Kehoe SIPAD Systems Inc 360-C Winkler Drive Alpharetta, GA. 30004 770-475-4576

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Matt Kehoe


Solid Solder Deposit | 16 November, 2001


Sorry, but I did not answer all your questions from your earlier message.

Your Question Are you saying that these products were not developed in Euroland?

Answer Well, SIPAD was invented in Europe, 1986, Siemens Lab in Munich Germany.

Optipad was developed in California by the late Larry Veelie.

PPT was developed in the US, either California of Florida, I cant remember, by the Hotlzmans, (spelling). It is alive and well as a coating service.

By the way, I have more materials in PDF format that you are welcome to if you want them. Customer testimonials, etc.



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Plasma prior Conformal Coating

Europlacer iineo+ SMT pick and place with integrated component tester