Can I have solder bridging two SM rectangular chip components due to misalignment? The bridging occurs at one end and is on a common trace between the two pads. The components are larger than the pad (side overhang) and are aligned rather perfectly when placed in the solder paste. The amount of misalignment is well within the limitations of 610C and HDBK-001 and I am not violating minimal electrical spacing requirements. Would this misalignment be considered a defect requiring rework?
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