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Measure Adhesive Properties of Solder Paste

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#57683

Measure Adhesive Properties of Solder Paste | 27 December, 2008

Hi,

Does anyone know how to determine the adhesive force of solder paste - specifically the ability of the paste to hold a component in place as it moves down the conveyors on an SMT line.

Thanks, DM

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#57684

Measure Adhesive Properties of Solder Paste | 28 December, 2008

A long time ago, Phil Zarrow wrote �Evaluating solder paste - not an option� to give tools for evaluating various solder paste properties. You are interested in �post placement tack.�

Find Phil's paper at: * His site http://www.itmconsulting.org

* http://dataweek.co.za/news.aspx?pklNewsId=27998

* http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=38988

We have no relationship, nor receive benefit from the company referenced above.

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#57717

Measure Adhesive Properties of Solder Paste | 6 January, 2009

Hi,

Test calls > Tack test - follow IPC standard TM650 #2.4.44.

Regards

Janz

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#57719

Measure Adhesive Properties of Solder Paste | 6 January, 2009

Years ago when we ran a solder paste evaluation we used the 2.4.44 method mentioned above. What we did was to print several coupons and let them sit for various times to see how the tack changed over time. Our goal was to see how long after print would the paste maintain it's tack.

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