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Solder paste dispenser choice

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#56943

Solder paste dispenser choice | 15 October, 2008

Hi All,

I am retrofitting a machine with a solder paste dispenser head, and am trying to decide what direction to go, with a dispense valve.

The choices I know are either a standard Air over, or some kind of positive displacement valve such as a screw valve.

In my dealings with solder paste dispensing the air over is OK but can lead to the material separating and inconsistent dispensing as the viscosity of the material changes, and the screw valve I tested kept getting paste stuck in the mechanism.

The dispensing that I am planning is not high speed micro dots, but more like lines of paste added after screening, that are required for a large shield component.

Please allow me to partake of the vast knowledge of this group as it pertains to solder paste dispensing.

Thanks all

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#57018

Solder paste dispenser choice | 20 October, 2008

Anyone have any info?

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#57019

Solder paste dispenser choice | 20 October, 2008

Why give away placement machine capacity for something that could be: * Stenciled * Hand dispensed

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#57041

Solder paste dispenser choice | 21 October, 2008

Have you checked Daan Terstegge's excellent jump site? http://www.smtinfo.net/Db/_Dispensing.html

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#57059

Solder paste dispenser choice | 23 October, 2008

The area in question requires more than can be stenciled, and at 50K-100K units I can't imaging how many people I would have to hire to hand dispense the material.

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#57060

Solder paste dispenser choice | 23 October, 2008

very good information.

Thank you

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#57090

Solder paste dispenser choice | 24 October, 2008

Hi, In your case definitely go with a pure time/pressure. If you want to make repeatable small dots later - only Archimedian screw. Another way is jet printing technology, which I assume is very expensive and far away from your case. Regards, Emil

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