Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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SMT electronics assembly manufacturing forum.


Non RoHs Requirement

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#56844

Non RoHs Requirement | 7 October, 2008

I have a job that requires a minimum of 3% lead in all component terminations. Anyone doing DOD out there with the same? How do you get around this with R's and C's especially? I believe we would be OK if the terminations were not pure tin as well but that has not been clarified. Any suggestions would be helpful.

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#56845

Non RoHs Requirement | 7 October, 2008

If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can do this for you, or you can do it in-house. You may find that your attrition is higher at P&P due to solder buildup on terminations - may need to tweak your program tolerances. Be careful on the lead finish conversion - some parts are heat sensitive, may need preheat to minimize damage. You'll also have to re-reel components afterwards.

Of course this adds lead time, extra steps, traceability(?), cost, cost, cost. Be sure to charge for the extra work.

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#56853

Non RoHs Requirement | 8 October, 2008

Kinda got that Mike but here is the problem. I have 1.8 mil parts that need to be NON-RoHS. 85% of those parts being STD R's and C's. I am looking for a place that provides at close to standard cost R's and C's with something besides pure tin terminations, preferably tin / lead. Sorry I wasn't clear. I am also looking to see if anyone out there has seen similar requirements and if so are there any loopholes in this that allow you to use standard R's and C's, ie coating the final product to highly reduce the potential for shorting due to Tin Wiskering. One other note. There is nothing on this board under 50 mil pitch and no BGA's.

Thanks again

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#56881

Non RoHs Requirement | 9 October, 2008

Why not build with a leaded paste or solder pot? You'll have more than 3% lead after solder. Who cares about before solder - any testing will be done on the finished product.

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#56887

Non RoHs Requirement | 9 October, 2008

Customer Specification, parts must be certified to have no less than 3% lead content on the lead prior to attach! It's a Hi Rel Mil Spec FAR Clause in the RFQ.

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