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BGA thermal reflowing issue

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#56701

BGA thermal reflowing issue | 26 September, 2008

Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what has happened to this? The PCB surface finsihing is OSP with regular lead-free 305/405 solder paste. Thanks SC

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#56705

BGA thermal reflowing issue | 26 September, 2008

Looks like lack of wetting. What is the BGA ball material? Could be high temp. Could be improper profile. Could be paste sat on board too long / flux dryout. Could be co-plane mount and this ball touched at the end of reflow curve. Could be contaminated ball.

Is this the only one or is the entire BGA like this. If so could be.....

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Reflow Oven

reflow oven profiler