Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA replacement process

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#56328

BGA replacement process | 3 September, 2008

Hi, Do we need to bake the board before doing the BGA replacement (not reball process). Thanks Phong Nguyen

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#56338

BGA replacement process | 4 September, 2008

If you plan to reuse the BGA, you probably should bake the moisture from the component prior to removing it from the board.

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#56416

BGA replacement process | 9 September, 2008

We bake before we replace our BGA's for at least 12 hours at 125C.

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#56417

BGA replacement process | 9 September, 2008

We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 years. Remember to remove any batteries from the board before baking.

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#56418

BGA replacement process | 9 September, 2008

I don't think so if your process is a just in time rework, you have just to develop a profile at your rework station for each component and also clean the place (board) properly. If your process is not a JIT rework, you must have to bake the boards, also you can develop a controlled process with hummidity eliminators.

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