Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Land Grid Array (LGA) Rework

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Land Grid Array (LGA) Rework | 25 August, 2008

Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"?

Like all of you, we build, profile place and solder for reliability, but the time will come when one of these components fail. How best to deal wit hthis package type?

Thanks in advance for your help!

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Land Grid Array (LGA) Rework | 26 August, 2008


Land Grid Array (LGA) Rework | 2 September, 2008

Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA rework station. Clean up the part and PCB by carefully removing extraneous solder, paste the PCB, (or the bottomside of the LGA itself) and replace. Reflow using the BGA rework station. Waaah Laaaa!

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Land Grid Array (LGA) Rework | 9 September, 2008

We get our component stencil for this type of rework from Mini-Micro Stencils. We use a Air-Vac rework station and we have no issues at all.

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Land Grid Array (LGA) Rework | 11 September, 2008

Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot air machine. Some places don't have the money to spend on mini micro stencils of all types, and thus spend the money on various sizes of solder balls to apply to components. I've had no problems with this process. Besides, it's much cleaner and faster than the pasting process.

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