Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Board change and solder not adhereing completely

kensmoke

#5886

Board change and solder not adhereing completely | 6 April, 2001

We recently had a multi block panal change at the vendor Now the production lines are producing solderability defects in great number. The makeup of the pcb is a type of fiber glass mask green in color and pads with no tinning just copper lands.

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CAL

#5889

Board change and solder not adhereing completely | 6 April, 2001

From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right.

My suggestion- go polyimide with electroptical connections (Sorry-bad joke)

You need a protectant on the pads. If a protectant is present seek an analytical lab to do Ion Chromatography. This will tell you if you have any contamination on the board - possibley left over from the Fab process.

CAL

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CAL

#5890

Board change and solder not adhereing completely | 6 April, 2001

From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right.

My suggestion- go polyamide with electroptical connections (Sorry-bad joke)

You need a protectant on the pads. If a protectant is present seek an analytical lab to do Ion Chromatography. This will tell you if you have any contamination on the board - possibly left over from the Fab process.

CAL

reply »


CAL

#5892

Board change and solder not adhereing completely | 6 April, 2001

Sorry about the double post.........my Vanna White spell check crapped out on the first reply.

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