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BGA Detached off the board

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#55930

BGA Detached off the board | 11 August, 2008

We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress was applied to the board

Can anyone explain the defect?

Thanks,

eyal

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#55933

BGA Detached off the board | 11 August, 2008

Sounds like solder is not taking to the pads of the BGA interposer. Check the solderability of the component.

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#55936

BGA Detached off the board | 11 August, 2008

I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.

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#55939

BGA Detached off the board | 11 August, 2008

> I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA.

hi

I mean that the the balls were left on the board and the BGA pads were found clean. What do you mean by "no lead BGA"?

Thanks

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#55940

BGA Detached off the board | 11 August, 2008

Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!

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#55943

BGA Detached off the board | 11 August, 2008

RoHS BGA. No lead in it.

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#55944

BGA Detached off the board | 11 August, 2008

> RoHS BGA. No lead in it.

> RoHS BGA. No lead in it.

ok.

this is not the case .It was sn/pb type...

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#55946

BGA Detached off the board | 11 August, 2008

Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads

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#55947

BGA Detached off the board | 11 August, 2008

Then your profile is way off. You need a t-couple mounted under the BGA on one of the center balls to measure correctly.

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