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Thermal Relief BGA footprint design - traces - reflow

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#54944

Thermal Relief BGA footprint design - traces - reflow | 2 June, 2008

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of a large copper surface. There is no thermal relief for the pad from the large ground area since there is no trace connected to the pad. No what I mean? So... I need to find some guidelines on how to design bga lands that incorprate thermal relief for achieving uniform reflow etc... Thanks! B

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#54954

Thermal Relief BGA footprint design - traces - reflow | 3 June, 2008

We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start.

I don't know for a fact that it contains info. that applies specifically to your issues, though.

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#54957

Thermal Relief BGA footprint design - traces - reflow | 3 June, 2008

If only my company would pay for a membership to IPC......

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#54958

Thermal Relief BGA footprint design - traces - reflow | 3 June, 2008

I'm in the same boat and have to pay a little more for the standards I insist on having. You just have to work on your sales pitch a little to convince the powers-that-be that you need it. Just tell them the difference is about $50k/year in scrap and rework.

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#54969

Thermal Relief BGA footprint design - traces - reflow | 3 June, 2008

This might be a good starting point for you: http://pcdandf.com/cms/content/view/3760/95/

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#54970

Thermal Relief BGA footprint design - traces - reflow | 4 June, 2008

Very informative article. Thanks Dave.

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