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Solder On Gold Mounting Holes, Gold Pressure Fit Socket Lands

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#54628

Solder On Gold Mounting Holes, Gold Pressure Fit Socket Lands | 6 May, 2008

I know IPC-A-610 RevD has requirements for Gold Fingers and solder contamination. Is there any such requirements for Gold Mounting Holes, Gold Pressure Fit Socket Lands (SMT pads), Exposed Gold Traces ? Wouldn't these all be considered "critical contact areas" and all fall under the same requirements as the Gold Fingers? With perhaps the exception of the exposed Gold Traces. We are getting tiny 3-15mil solder spots in these areas and are trying to determine if it is neccessary to repair them. Any input would be greatly appreciated.

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#54630

Solder On Gold Mounting Holes, Gold Pressure Fit Socket Lands | 6 May, 2008

We agree. We consider mounting holes and press fgit socket pads to be "critical contact areas."

Consider taking steps to prevent the production of such solder splats on your gold to help elimate gold rework. We discussed this previously here on SMTnet. Search the fine SMTnet Archive for more.

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