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Is there a cross section standard test method...

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#54144

Is there a cross section standard test method... | 24 March, 2008

Hello all, we have been seeing a lot of issues with broken or open vias on a couple of our bare boards. We have two vendors make these for us and the issue is only with one vendors boards. We have stopped using them until we can figure out what is going on. I gave them a failed board for analysis and it came back of course with no problem found. The board they sent back looked like it had been cut with a dremel or a band saw. It wasnt polished or even smooth at all like other samples I have seen. So my question is this, Is there a standard for which to cross section a PCB for analysis? If there is I would like to show them it and have the test done again...

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#54146

Is there a cross section standard test method... | 24 March, 2008

No standard, but common practice is: IPC-TM-650 Test Methods Manual * Method 2.1.1, Microsectioning, Manual Method * Method 2.1.1.2, Microsectioning, Semi or Automatic Technique

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#54147

Is there a cross section standard test method... | 24 March, 2008

Thats the one I found while researching this AM also. Thanks for the assist. Any ideas if this can be process related? Im sure it can be but its odd that it only happens on one vendors board. I think because it is an 10 layer board that maybe they have issues making it. We get a lot of X'ed out panels from them (board is a pallet of two)

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#54154

Is there a cross section standard test method... | 24 March, 2008

As you say, just about defect can be tied to process, one way or another. If you want to think about it, search the fine SMTnet Archives for background on barrel cracking.

Other things are: * How thick is the actual via plating from the two suppliers? * We're trying to post some references to papers, but SMTnet won't let us. We'll check with Roland to determine what we're doing wrong. * If you want unbiased analysis, use an independant laboratory.

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#54160

Is there a cross section standard test method... | 25 March, 2008

References [Analog Devices] 1) "Surface Preparation and Microscopy of Materials" B Bousfield, John Wiley & Sons, LTD., West Susse_, England, 1992 2) "Metallography Principles and Procedures" Leco, Corp. 1992 3) "Buehler Dialog, Microstructural Analysis Reference Manual" Buehler, LTD. 4) "Metalog Guide, Your Guide to the Perfect Materialographic Structure" Struers Corp. 1992 5) "Advanced Techniques for High Speed Precision Sectioning" SN Chanat, AMH Trujillo, DC Zipperian, Buehler Digest, Vol. 27, No. 1, Buehler, LTD 1993 6) "SEM, A User's Manual for Materials Science" BL Gabriel, American Society for Metals 1985 7) "Principles and Practices of Electron Microscope Operation" AM Glauert, AW Agar, RH Anderson, D Chescoe, North-Holland Publishing Company, Amsterdam 1974

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#54161

Is there a cross section standard test method... | 25 March, 2008

Turns out, SMTnet didn't want us to use the name of the town where the publisher of Reference 1 is located.

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#54162

Is there a cross section standard test method... | 25 March, 2008

Along the lines of this topic.....

Does anyone know about the going rate for a cross sectional analysis including the report from 3rd party labs for this service?

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#54174

Is there a cross section standard test method... | 26 March, 2008

hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts / opens / cracks Large sample: vertical / diagonal $350.00 Board issues Special sample: / Multi-Layer Horizontal / Ceramic package $400.00 - $500.00 Report $150.00/hour. This are from US. In europe is more expensive.

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