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LGA stencil parameters

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CL

#53904

LGA stencil parameters | 4 March, 2008

Good Morning,

I have an application that we are tooling up for that has several LGA (Land Grid Array) components. The Gerber files from the customer has a solder paste definition of 1:1 to the pad. As I look at this part, I cannot believe that this will not cause an issue. Does anyone have experience with this type of component?

Any help would be greatly appreciated.

Thanks In Advance

Chris

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#53905

LGA stencil parameters | 4 March, 2008

Everything you wanted to know (and possibly didn't want to know) http://www.freescale.com/files/32bit/doc/package_info/AN2920.pdf

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#53906

LGA stencil parameters | 4 March, 2008

Depends on your board? What finish? Solder mask between all pads? What pitch is the part? Will it machine placed? Don't forget proper profiling as well.

1:1 with machine placement should yield no issues.

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