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Soldering problem on BGA with SAC105 bump

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#53888

Soldering problem on BGA with SAC105 bump | 4 March, 2008

I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total Time above liquiduos? btw, we use SAC305 solderpaste. Thanks in advance for any input.

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#53891

Soldering problem on BGA with SAC105 bump | 4 March, 2008

Can you describe what you mean by "pillow effect" Do you have any photos ?

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#53893

Soldering problem on BGA with SAC105 bump | 4 March, 2008

The attached photo from cross section. (like head in pillow)

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