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Sn96.5Ag3.5 Lead Free solder

Sze-Pei LIM

#1770

Sn96.5Ag3.5 Lead Free solder | 25 February, 2000

We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooling works the best so far, but the void is still around 10-15%. Any idea how to reduce it further? Our spec. is less than 10%.

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#1771

Re: Sn96.5Ag3.5 Lead Free solder | 25 February, 2000

Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we?

BGA voiding is a function of materials, methods, environment, and human factors. Considering "material factors" driving void formation, solder paste formulation is the most critical.

Ta

Dave F

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#1772

Re: Sn96.5Ag3.5 Lead Free solder | 26 February, 2000

Sze-Pei: Your e-mail address doesn't work. Dave

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