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Voiding in Underfill process

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ray

#53275

Voiding in Underfill process | 21 January, 2008

Is there a tool to check for voiding in a Underfill process?

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#53280

Voiding in Underfill process | 21 January, 2008

Yes. It's called a surface acoustic microscope. Rent time at your local university or college.

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ray

#53282

Voiding in Underfill process | 21 January, 2008

hi dave

Is there another tool besides SAM (Scanning Acoustic Microscopy)?

Regards, Ray

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#53286

Voiding in Underfill process | 21 January, 2008

We have read papers espousing using xray, but have never seen such a thing. It seems the contrast provided in the xray images is insufficient for analysis of the underfill.

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ray

#53296

Voiding in Underfill process | 22 January, 2008

Thanks Dave, I spoke with a Loctite application person yesterday and the mentioned SAM as well.

best regards,

Ray

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#53297

Voiding in Underfill process | 22 January, 2008

Here's an article on flux / underfill compatibility http://ap.pennnet.com/articles/print_toc.cfm?p=36&v=16&i=6

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#53341

Voiding in Underfill process | 23 January, 2008

You can do a destructive test to sort of check your process. Break off the flipchip and look for voids. I have used Namics 8437-2 for the last 7 or 8 years. Good stuff. Flows under a 0.001" gap with no voids.

Chris

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