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Thermal screening for marginal BGA joints

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#52285

Thermal screening for marginal BGA joints | 2 November, 2007

Hi experts,

1) Do you think a non-operating temperature cycling would do good for screening some marginal BGA joints?

2) If yes, what the exterm temperatures I should go?

3) Any particular profile that is suitable for my need?

Thank you!!

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#52287

Thermal screening for marginal BGA joints | 3 November, 2007

IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree

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#52329

Thermal screening for marginal BGA joints | 6 November, 2007

I'm not sure what kind of marginal joint you're trying to identify, but when we went through a serious ball-in-cup problem a few years ago we tried hot & cold functional test as well as a day or two of -40/+125C thermal cycling and all were pretty poor at identifying boards with bad joints. Without going back through my notebook, I'd estimate that each of these tests uncovered about 20% of the BGAs with ball-in-cup.

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#52444

Thermal screening for marginal BGA joints | 9 November, 2007

Thank you to Dave and Scott!!

What I'm delaing with is mass production test for small memory cards in volume!

The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chamber, cook them, and do my final system level test on MBs.

What I expect is to screen out some marginal BGA solder joints with head in pillow, improper wetting, partial opening, or even cold sodler issues.

Thank you very much with your input.

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