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SMT electronics assembly manufacturing forum.


micropad solder problem ?

Views: 2638

#52273

micropad solder problem ? | 1 November, 2007

CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.

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#52288

micropad solder problem ? | 3 November, 2007

Sounds like your reflow temperature recipe is a mess. * CSP has pillow => Flux exhaused or CSP never came to peak temperature * BGA balls don't combine with the solder => Flux exhaused or BGA balls never came to peak temperature * 0402 surface looks like many tin balls piled together => Flux exhaused

Start your thermal recipe with you paste supplier's recommendation, measuring temperature of the solder on the terminations of low and high mass components. Search the fine SMTnet Archives for previous discussion on recipes and profiling [profile].

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#52314

micropad solder problem ? | 5 November, 2007

Not only a wizard but a damn good interrupter too there Dave.

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RDR

#52341

micropad solder problem ? | 6 November, 2007

Sounds like you did not achieve reflow at all, what max temp did you hit in oven?

Russ

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