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XBOX 360, BGA ball problem?

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#52192

XBOX 360, BGA ball problem? | 25 October, 2007

I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of weak joints...the fully melted joint at the outer part of BGA also be affected (crack also)

Any comments....

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#52205

XBOX 360, BGA ball problem? | 25 October, 2007

should have provide the link for all of you to look at it.... http://techon.nikkeibp.co.jp/article/HONSHI/20070926/139719/ to look at the real case study......:)

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#52215

XBOX 360, BGA ball problem? | 26 October, 2007

Even a proper solder joint will fail if the rite stresses are applied to it. Sounds like you have an over heating issues, not a solder issue.

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