Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


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Void | 6 September, 2007

Can voids be carried over from original voids in solder balls during reflow?

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Void | 17 September, 2007

We have never studied this, but here's what we'd guess. If there are void in BGA solder balls at inbound: * A proper reflow recipe will eliminate the void. * A poor recipe will allow the void to remain and possibly generate additional void.

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Void | 19 September, 2007

yes they can, we have re-reflowed BGAs for voids and have noticed that they are still there.

I believe that DaveF may have good point as well as I would also believe that you could remove them but I have not yet been able to

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